 |
| Quantity: | |
|---|---|
Silicon Nitride | Unit | 热压烧结 | 反应烧结 |
Density | ≥g/cm³ | 3.24 | 2.4-2.6 |
Hardness | ≥HV | 1490 | 790 |
Resistance To Bending Degrees | ≥Mpa | 990 | 280 |
Fracture Toughness | Mpa.m0.5 | 6-8 | |
Maximum Service Temperature | ℃ | ||
Coefficient Of Linear Expansion | X10-6 /℃.K | 3.28 | 2.99 |
Dielectric Constant | 20℃,1MHZ | 8.3 | 8.3 |
Elasticity Modulus | Gpa | 290-380 | |
Heat Conductivity Coefficient | W/m.K(20℃) | 28.8 | 10.1 |
Silicon Nitride | Unit | 热压烧结 | 反应烧结 |
Density | ≥g/cm³ | 3.24 | 2.4-2.6 |
Hardness | ≥HV | 1490 | 790 |
Resistance To Bending Degrees | ≥Mpa | 990 | 280 |
Fracture Toughness | Mpa.m0.5 | 6-8 | |
Maximum Service Temperature | ℃ | ||
Coefficient Of Linear Expansion | X10-6 /℃.K | 3.28 | 2.99 |
Dielectric Constant | 20℃,1MHZ | 8.3 | 8.3 |
Elasticity Modulus | Gpa | 290-380 | |
Heat Conductivity Coefficient | W/m.K(20℃) | 28.8 | 10.1 |
